Yu-An Shen
About
Yu-An Shen has authored 58 papers that have received a total of 746 indexed citations.
This includes 41 papers in Electrical and Electronic Engineering, 32 papers in Mechanical Engineering and 13 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (21 papers) and Intermetallics and Advanced Alloy Properties (13 papers). Yu-An Shen is often cited by papers focused on Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (21 papers) and Intermetallics and Advanced Alloy Properties (13 papers) and collaborates with scholars based in Taiwan, Japan and China. Yu-An Shen's co-authors include Hiroshi Nishikawa, Siliang He, Jiahui Li, Shiqi Zhou and Chih Chen and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Scientific Reports
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