Yufeng Jin

75 papers and 939 indexed citations i.

Yufeng Jin has authored 75 papers that have received a total of 939 indexed citations. This includes 45 papers in Electrical and Electronic Engineering, 21 papers in Biomedical Engineering and 9 papers in Aerospace Engineering. The topics of these papers are 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (10 papers) and Advanced Sensor and Energy Harvesting Materials (9 papers). Yufeng Jin is often cited by papers focused on 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (10 papers) and Advanced Sensor and Energy Harvesting Materials (9 papers) and collaborates with scholars based in China, United States and Singapore. Yufeng Jin's co-authors include Min Miao, Shenglin Ma, Min Yu and Yilong Hao and has published in prestigious journals such as ACS Applied Materials & Interfaces, Small and International Journal of Heat and Mass Transfer