IEEE Transactions on Components Packaging and Manufacturing Technology

3.0k papers and 29.1k indexed citations i.

The 3.0k papers published in IEEE Transactions on Components Packaging and Manufacturing Technology in the last decades have received a total of 29.1k indexed citations. Papers published in IEEE Transactions on Components Packaging and Manufacturing Technology usually cover Electrical and Electronic Engineering (2.4k papers), Mechanical Engineering (688 papers) and Biomedical Engineering (431 papers) specifically the topics of 3D IC and TSV technologies (908 papers), Electronic Packaging and Soldering Technologies (861 papers) and Electromagnetic Compatibility and Noise Suppression (541 papers). The most active scholars publishing in IEEE Transactions on Components Packaging and Manufacturing Technology are Rao Tummala, Xiaowu Zhang, Joungho Kim, Venky Sundaram and Muhannad S. Bakir