A. K. Sarkhel
About
A. K. Sarkhel has authored 9 papers that have received a total of 576 indexed citations.
This includes 6 papers in Mechanical Engineering, 5 papers in Electrical and Electronic Engineering and 2 papers in Atmospheric Science. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (4 papers) and Intermetallics and Advanced Alloy Properties (4 papers). A. K. Sarkhel is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (4 papers) and Intermetallics and Advanced Alloy Properties (4 papers) and collaborates with scholars based in United States and South Korea. A. K. Sarkhel's co-authors include Sung K. Kang, L. Seigle, Timothy Gosselin, Da‐Yuan Shih and Karl J. Puttlitz and has published in prestigious journals such as Thin Solid Films, Journal of materials research/Pratt's guide to venture capital sources and Metallurgical Transactions A
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Mikołaj Żmudziński are published in Top fields papers by Jason Dominic are about Top authors papers by Trisha F. Barrett are co-authored with Top authors papers by Hilda Tiricz are co-authored with Top fields papers by Julian Reitz are about Top countries impacted by papers by Catherine A. Holland Top countries impacted by papers by Sean Blair Top journals papers by James L. Robinson are published in