A. K. Sarkhel
About
A. K. Sarkhel has authored 9 papers that have received a total of 576 indexed citations.
This includes 6 papers in Mechanical Engineering, 5 papers in Electrical and Electronic Engineering and 2 papers in Atmospheric Science. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (4 papers) and Intermetallics and Advanced Alloy Properties (4 papers). A. K. Sarkhel is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (4 papers) and Intermetallics and Advanced Alloy Properties (4 papers) and collaborates with scholars based in United States and South Korea. A. K. Sarkhel's co-authors include Sung K. Kang, L. Seigle, Timothy Gosselin, Da‐Yuan Shih and Karl J. Puttlitz and has published in prestigious journals such as Thin Solid Films, Journal of materials research/Pratt's guide to venture capital sources and Metallurgical Transactions A
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