Byung-Jin Park

17 papers and 913 indexed citations i.

Byung-Jin Park has authored 17 papers that have received a total of 913 indexed citations. This includes 4 papers in Electrical and Electronic Engineering, 4 papers in Strategy and Management and 4 papers in Marketing. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), Business Strategy and Innovation (4 papers) and 3D IC and TSV technologies (3 papers). Byung-Jin Park is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), Business Strategy and Innovation (4 papers) and 3D IC and TSV technologies (3 papers) and collaborates with scholars based in South Korea and United States. Byung-Jin Park's co-authors include Dohee Kim, Kyung‐Wook Paik, Soon-Bok Lee, Il‐Ho Kim and Hwa‐Young Son and has published in prestigious journals such as Journal of Applied Physics, Tourism Management and Composite Structures