C.-Y. Li

41 papers and 382 indexed citations i.

C.-Y. Li has authored 41 papers that have received a total of 382 indexed citations. This includes 30 papers in Electrical and Electronic Engineering, 17 papers in Electronic, Optical and Magnetic Materials and 12 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (24 papers), Copper Interconnects and Reliability (17 papers) and 3D IC and TSV technologies (12 papers). C.-Y. Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), Copper Interconnects and Reliability (17 papers) and 3D IC and TSV technologies (12 papers) and collaborates with scholars based in United States, France and Australia. C.-Y. Li's co-authors include M. A. Korhonen, Peter Børgesen, D. D. Brown, P. Bo rgesen and Tia‐Marje Korhonen and has published in prestigious journals such as Applied Physics Letters, Scripta Materialia and Thin Solid Films