Da‐Yuan Shih
About
Da‐Yuan Shih has authored 41 papers that have received a total of 1.8k indexed citations.
This includes 38 papers in Electrical and Electronic Engineering, 23 papers in Mechanical Engineering and 6 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (22 papers) and Advanced Welding Techniques Analysis (11 papers). Da‐Yuan Shih is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (22 papers) and Advanced Welding Techniques Analysis (11 papers) and collaborates with scholars based in United States, South Korea and Canada. Da‐Yuan Shih's co-authors include Sung K. Kang, Paul Lauro, C. C. Goldsmith, Jin Yu and S. K. Kang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Transactions on Electron Devices.
In The Last Decade
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