Hongtao Chen

52 papers and 819 indexed citations i.

Hongtao Chen has authored 52 papers that have received a total of 819 indexed citations. This includes 30 papers in Electrical and Electronic Engineering, 30 papers in Mechanical Engineering and 10 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (19 papers) and Aluminum Alloys Composites Properties (10 papers). Hongtao Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (19 papers) and Aluminum Alloys Composites Properties (10 papers) and collaborates with scholars based in China, Australia and United States. Hongtao Chen's co-authors include Mingyu Li, Chunqing Wang, Chunjin Hang, Zhihao Zhang and Jing Han and has published in prestigious journals such as Advanced Functional Materials, Acta Materialia and Scientific Reports.