Junghwan Bang
About
Junghwan Bang has authored 48 papers that have received a total of 374 indexed citations.
This includes 45 papers in Electrical and Electronic Engineering, 30 papers in Mechanical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (40 papers), 3D IC and TSV technologies (32 papers) and Advanced Welding Techniques Analysis (17 papers). Junghwan Bang is often cited by papers focused on Electronic Packaging and Soldering Technologies (40 papers), 3D IC and TSV technologies (32 papers) and Advanced Welding Techniques Analysis (17 papers) and collaborates with scholars based in South Korea, Japan and China. Junghwan Bang's co-authors include Chang‐Woo Lee, Yong-Ho Ko, Taek‐Soo Kim, Jeong‐Won Yoon and Min‐Su Kim and has published in prestigious journals such as Scientific Reports, Small and Journal of Alloys and Compounds
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