T. Marieb
About
T. Marieb has authored 41 papers that have received a total of 484 indexed citations.
This includes 32 papers in Electronic, Optical and Magnetic Materials, 26 papers in Electrical and Electronic Engineering and 12 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (32 papers), Electronic Packaging and Soldering Technologies (16 papers) and Semiconductor materials and devices (15 papers). T. Marieb is often cited by papers focused on Copper Interconnects and Reliability (32 papers), Electronic Packaging and Soldering Technologies (16 papers) and Semiconductor materials and devices (15 papers) and collaborates with scholars based in United States, France and Germany. T. Marieb's co-authors include J. C. Bravman, P. A. Flinn, Michael C. Madden, Paul A. Flinn and Richard Celestre and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Journal of Applied Physics
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Burak Bilecenoğlu are published in Top authors papers by Mohamadu Boyie Jalloh are co-authored with Top authors papers by Fu-Hsiang Wong are co-authored with Top journals papers by Takuya Umedachi are published in Top authors papers by Cheng‐Yuan Liou are co-authored with Top fields papers by Wooseok Ji are about Top fields papers by Ernest Carroll Faust are about Top countries impacted by papers by Delores Danilowicz