Tae-Kyu Lee

56 papers and 1.0k indexed citations i.

Tae-Kyu Lee has authored 56 papers that have received a total of 1.0k indexed citations. This includes 51 papers in Electrical and Electronic Engineering, 25 papers in Mechanical Engineering and 9 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (47 papers), 3D IC and TSV technologies (35 papers) and Integrated Circuits and Semiconductor Failure Analysis (11 papers). Tae-Kyu Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (47 papers), 3D IC and TSV technologies (35 papers) and Integrated Circuits and Semiconductor Failure Analysis (11 papers) and collaborates with scholars based in United States, South Korea and Hong Kong. Tae-Kyu Lee's co-authors include Thomas R. Bieler, Bite Zhou, Kuo-Chuan Liu, Jenq‐Gong Duh and Farhang Pourboghrat and has published in prestigious journals such as Materials Science and Engineering A, Scripta Materialia and Materials & Design