V. Bader
About
V. Bader has authored 11 papers that have received a total of 69 indexed citations.
This includes 10 papers in Electrical and Electronic Engineering, 3 papers in Automotive Engineering and 2 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Additive Manufacturing and 3D Printing Technologies (3 papers). V. Bader is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Additive Manufacturing and 3D Printing Technologies (3 papers) and collaborates with scholars based in Germany. V. Bader's co-authors include R. Aschenbrenner, Tanja Braun, H. Reichl, Matthias Koch and K.-F. Becker and has published in prestigious journals such as Microelectronics Reliability, Journal of Electronic Packaging and IEEE Transactions on Electronics Packaging Manufacturing
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