Vijay Sukumaran
About
Vijay Sukumaran has authored 6 papers that have received a total of 227 indexed citations.
This includes 6 papers in Electrical and Electronic Engineering, 3 papers in Biomedical Engineering and 2 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (3 papers) and Nanofabrication and Lithography Techniques (3 papers). Vijay Sukumaran is often cited by papers focused on 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (3 papers) and Nanofabrication and Lithography Techniques (3 papers) and collaborates with scholars based in United States, Japan and Morocco. Vijay Sukumaran's co-authors include Rao Tummala, Venky Sundaram, Yoichiro Sato, Gokul Kumar and Tapobrata Bandyopadhyay and has published in prestigious journals such as Journal of Materials Science Materials in Electronics and IEEE Transactions on Components Packaging and Manufacturing Technology.
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