Xiaowu Hu
About
Xiaowu Hu has authored 168 papers that have received a total of 2.9k indexed citations.
This includes 124 papers in Mechanical Engineering, 110 papers in Electrical and Electronic Engineering and 41 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (95 papers), 3D IC and TSV technologies (57 papers) and Advanced Welding Techniques Analysis (35 papers). Xiaowu Hu is often cited by papers focused on Electronic Packaging and Soldering Technologies (95 papers), 3D IC and TSV technologies (57 papers) and Advanced Welding Techniques Analysis (35 papers) and collaborates with scholars based in China, United States and Italy. Xiaowu Hu's co-authors include Xiongxin Jiang, Yulong Li, Qinglin Li, Zhixian Min and Shikun Xiao and has published in prestigious journals such as Chemical Engineering Journal, ACS Applied Materials & Interfaces and Applied Energy
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