Yanhong Tian
About
Yanhong Tian has authored 198 papers that have received a total of 3.2k indexed citations.
This includes 156 papers in Electrical and Electronic Engineering, 82 papers in Mechanical Engineering and 40 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (89 papers), 3D IC and TSV technologies (58 papers) and Nanomaterials and Printing Technologies (30 papers). Yanhong Tian is often cited by papers focused on Electronic Packaging and Soldering Technologies (89 papers), 3D IC and TSV technologies (58 papers) and Nanomaterials and Printing Technologies (30 papers) and collaborates with scholars based in China, Canada and Spain. Yanhong Tian's co-authors include Chenxi Wang, Chunqing Wang, Shang Wang, He Zhang and Chunjin Hang and has published in prestigious journals such as Advanced Materials, ACS Nano and Energy & Environmental Science
In The Last Decade
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