Mingyu Li
About
Mingyu Li has authored 224 papers that have received a total of 4.2k indexed citations.
This includes 149 papers in Electrical and Electronic Engineering, 117 papers in Mechanical Engineering and 36 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (114 papers), 3D IC and TSV technologies (68 papers) and Aluminum Alloys Composites Properties (46 papers). Mingyu Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (114 papers), 3D IC and TSV technologies (68 papers) and Aluminum Alloys Composites Properties (46 papers) and collaborates with scholars based in China, South Korea and Singapore. Mingyu Li's co-authors include Hongjun Ji, Chunqing Wang, Hongtao Chen, Jongmyung Kim and Hongtao Chen and has published in prestigious journals such as Nature, Angewandte Chemie International Edition and Advanced Materials
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