Sehoon Yoo

68 papers and 442 indexed citations i.

Sehoon Yoo has authored 68 papers that have received a total of 442 indexed citations. This includes 55 papers in Electrical and Electronic Engineering, 29 papers in Mechanical Engineering and 8 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (43 papers) and Advanced Welding Techniques Analysis (17 papers). Sehoon Yoo is often cited by papers focused on Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (43 papers) and Advanced Welding Techniques Analysis (17 papers) and collaborates with scholars based in South Korea, Japan and Yemen. Sehoon Yoo's co-authors include Chang‐Woo Lee, Yong-Ho Ko, Junki Kim, Young‐Ho Kim and Seung‐Boo Jung and has published in prestigious journals such as Carbon, Journal of Alloys and Compounds and Thin Solid Films